OCSmaterials Successfully Concludes INTERBATTERY 2026 with SABA Collaboration

OCSmaterials successfully participated in INTERBATTERY 2026, held from March 11 to 13, 2026, at COEX, Seoul.
At Booth D575, the company showcased a wide range of thermal management solutions to global customers and industry professionals.

During the exhibition, OCSmaterials presented its Thermal Interface Materials (TIMs) for high-heat applications such as battery packs, inverters, converters, and OBC/ICCU systems, along with customized, integrated thermal management solutions tailored to real application environments.

Total E-BONDING System through OCS × SABA Collaboration

A key highlight of the exhibition was the Total E-BONDING System, developed in collaboration with global partner SABA.
This system represents an integrated design approach, combining thermal interface materials and structural adhesive solutions, moving beyond conventional material-based applications.

OCSmaterials (Thermal Interface Engineering)

• High-performance TCA / Gap Filler / Grease / Encapsulant / Gap Pad

• Optimized heat transfer efficiency through BLT (Bond Line Thickness) control

• Customer-oriented solutions through customized material development

SABA (Structural Adhesive & Sealing Technology)

• MS Polymer-based structural bonding and sealing solutions

• Excellent elasticity and environmental resistance (heat and moisture)

• Reliable adhesion between dissimilar materials with long-term durability

By approaching at a system level, both companies deliver:

• Integrated design of Thermal Path + Structural Integrity

• A total solution considering both product performance and assembly processes
  
  

  E-BONDING System (Technical Concept)

  The E-BONDING System integrates thermal management and structural bonding into a single system,
  replacing the conventional “thermal + mechanical fastening” dual structure.  
  
  
  
  

  1. Thermal Performance

  • High thermal conductivity TIMs with optimized filler systems

  • Reduced contact resistance through minimized interfacial voids

  • Uniform BLT formation for efficient heat transfer paths

  2. Mechanical Reliability

  • Stress relaxation from CTE mismatch via MS Polymer flexibility

  • Stable bonding performance under vibration and shock conditions

  3. Process Optimization

  • Reduction of mechanical fastening and pad insertion processes

  • Compatibility with dispensing-based automated production

  • Reduced part count and improved assembly efficiency

  As a result, the system enables a system-level solution that simultaneously achieves:
  Performance (Thermal) + Reliability (Mechanical) + Productivity (Process)
  
  
  

  Conclusion & Future Direction

  Through INTERBATTERY 2026, OCSmaterials demonstrated its capability beyond a conventional TIM supplier,
  positioning itself as a provider of integrated thermal and bonding solutions in collaboration with SABA.

  The Total E-BONDING System, combining OCSmaterials’ thermal expertise and SABA’s structural bonding technology,
  offers a practical solution to meet the growing demands for high reliability and high efficiency design in the EV and energy industries.

  Moving forward, both companies will continue to strengthen their collaboration through joint development and technical innovation,
  expanding next-generation integrated solutions that enhance design flexibility and optimize manufacturing processes in the global market.